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현재위치 > 제품소개 > 반도체장비 > Panasonic

반도체장비

MDP200 MDP200
Model ID MD-P200
Model No. NM-EFD1B
Productivity
*1		 0.56 s / IC（Under the fastest
conditions
0.75 s/ IC for thermosonic
bonding（Including process time of
0.2 seconds. Under the fastest
conditions）
Placement accuracy
*1		 XY（3σ at PFSC conditions） :
±7 µm（Flip bonding）,
±15 µm（With pre-centering）,
±25 µm（Direct bonding)
Substrate dimensions L 50 mm × W 30 mm to L 280 mm ×
W 140 mm（For thermosonic :
L 200 mm × W 150 mm）
Die dimensions L 0.25 mm × W 0.25 mm to
L 6 mm × W 6mm
Number of
die types		 Up to 12 type（s For AWC）/
UP to 10 types（Tray with the palette
changer）/
Up to 5 types（Wafer frame
with the palette changer）
Die supply Wafer frame, Pre-expanded ring, Tray
Adhesive dispenser Air-powered writing, Stamping pin,
Bonding
load		 Pneumatic head : 0.5 N to 10 N
（Option : 1 N to 50 N）
VCM head for thermosonic process :
1 N to 50 N （Option : 2 N to 100 N）
Head heating Constant heating, Up to 250℃ for
the pneumatic head, Up to 300℃
for the VCM head
Substrate heating Constant heating, Up to 300℃
Number of
nozzle		 Up to 24 nozzles（Pickup nozzle,
Bonding nozzle, Stamping tool）
（Not available for the thermosonic
nozzle）
Power source
*2		 3-phase AC 200 V ±10V, 50 / 60 Hz,
Up to 4 kVA（Up to 7 kVA for heating
specification）
Pneumatic
source		 0.5 MPa, 30 L / min（A.N.R.）
（Up to 150 L / min for full-featured
machine including cooling air）
Dimensions Standard specification
（Up to 200 mm substrate length.
Including loader/unloader）
W 1 950 mm × D 1 190 mm
× H 1 720 mm（Machine body :
W 1 190 mm × D 1 190 mm
× H 1 720 mm）
Mass 2,200 Kg（Including loader / unloader）
    • *1 :
    • The described productivity and placement accuracy may differ depending on the conditions of use.
    • *2 :
    • Three phase 208 / 220 / 380 / 400 / 415 / 480
    • For more details, please refer to the specification sheet.
MDP200