반도체장비

Model ID	PSX307A
Model No.	NM-EFP3A
Cleaning Method	Parallel plate RF back-sputtering method
Gas for Electrical Discharge *1	Ar [Option：O2, O2 + He］
Power source	1-phase AC 200 / 208 / 220 / 230 / 240 ± 10 V, 50 / 60 Hz , 6.00 kVA
Pneumatic source	0.49 MPa, 50 L / min［A.N.R］
Dimension *2	W 900 mm× D 1,150 mm × H 1,650 mm
Mass *3	630 kg

Specification（Target work） *4	Substrate	Wafer with dicing ring	Wafer without dicing ring
Work Size *5	L 50 mm × W 30 mm *6 ～ L 350 mm × W 350 mm	Φ300mm *7	Φ300mm

*Please refer to the specifications on details
*Pre-confirmation by customer's works is required.
- *1 :
- If the optional oxygen gas is selected as electric discharge gas, nitrogen gas is also required to dilute exhaust
- *2 :
- Excluding touch panel, emergency stop switch and signal tower.
- *3 :
- In case of full option
- *4 :
- Please select a specification among three
- *5 :
- Please consult us about the substrate thickness
- *6 :
- Please contact us for the substrate with depth < 30mm
- *7 :
- outer diameter of ring : □380mm