반도체장비

Model ID	MD-P300
Model No.	NM-EFF1C
Productivity *1	C4：0.65s / IC（including dipping motion）, Thermosonic：0.65s / IC（including US process time of 0.2s）
Placement accuracy *1	XY（3σ at PFSC conditions）：±5 µm
Substrate dimensions	L 50 mm × W 50 mm to L 330 mm × W 330 mm （Heating specifications ： L 330 mm × W 220 mm）
Die dimensions	L 1 mm × W 1 mm to L 25 mm × W 25 mm （ Thermosonic ： L7 mm × W 7 mm）
Number of die types	Up to 12 product types (AWC specifications) *1 nozzle type
Die supply	Wafer frame 12 inches （Option：8 inches）
Bonding load	VCM head ： 1N to 50 N （Option：2 N to 100 N）
Head heating	Thermosonic ： Up to 300℃
Substrate heating*2	Constant heating, Up to 200℃ （Heating bonding stage specifications: Max. substrate size L 330 mm × W 220 mm）
Power source *3	3-phase AC 200V ± 10V, 50/60 Hz, Up to 4 kVA （Up to 7 kVA for heating specification）
Pneumatic source	0.4 Mpa, 50L/min（A.N.R.）（Up to 150 L/min for full-featured machine including cooling air）
Dimensions	W 1,380 mm × D 1,640 mm × H 1,430 mm （ without loader / unloader）
Mass	2,300 kg （ without loader / unloader）

- *1 :
- The described productivity and placement accuracy may differ depending on the conditions of use.
- *2 :
- Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually.
- *3 :
- 3-phase 208 / 220 / 380 / 400 / 415 / 480
- For details, please refer to the specification sheet.